PURPOSE: To reduce the adjustment time of an oscillating frequency more than that of the method adopting conventional wire bonding by connecting a power supply and a frequency counter to a printed circuit board and applying wire bonding to a pattern power supply while measuring the oscillating frequency of a surface acoustic wave oscillating circuit.

CONSTITUTION: A wire bonding device 10 includes a bonding head 12, a power supply 16 and a frequency counter 18. When a printed circuit board 30 is placed on a stage 14, an output terminal 20 of the power supply 16 and an input terminal 22 of the frequency counter 18 are connected to the printed circuit board 30. A conductor pattern 32 of the printed circuit board 30 is wire-bonded by the bonding head 12. Then a surface acoustic wave oscillating circuit is formed, the circuit is driven by the power supply 16 and the oscillating frequency is measured by the frequency counter 18. When the oscillating frequency is improper, the conductor pattern 32 of the printed circuit board 30 is deviated and wire-bonded and again the oscillating frequency is measured, When a proper oscillating frequency is obtained, the surface acoustic wave oscillating circuit is made complete.