Title:
Actinic light-sensitive or radiation-sensitive resin composition, pattern forming method, and manufacturing method of electronic device
Document Type and Number:
Japanese Patent JP6368786
Kind Code:
B2
Abstract:
The present invention has an object to provide an active-light-sensitive or radiation-sensitive resin composition having high DOF and low LWR; a pattern forming method using the composition; and a method for manufacturing an electronic device. The active-light-sensitive or radiation-sensitive resin composition of the present invention includes a resin P and a compound that generates an acid upon irradiation with active light or radiation, in which the resin P has a repeating unit p1 and a repeating unit p2 represented by specific formulae, and the repeating unit p2 does not have a group in which a hydroxy group of a hydroxyadamantyl group is protected with a group that decomposes by the action of an acid to leave.
Inventors:
Kenyo Goto
Masashi Kojima
Keita Kato
Wang Ye-yeon
Shirakawa Mitsuhiro
Masashi Kojima
Keita Kato
Wang Ye-yeon
Shirakawa Mitsuhiro
Application Number:
JP2016546423A
Publication Date:
August 01, 2018
Filing Date:
August 21, 2015
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/038; C08F220/12; G03F7/039; G03F7/20
Domestic Patent References:
| JP2014145809A | ||||
| JP2014038257A | ||||
| JP2013097272A | ||||
| JP2012113143A | ||||
| JP2014170167A |
Foreign References:
| US20140242519 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi
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