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Patent Searching and Data


Title:
ADSORPTION HEAT PUMP
Document Type and Number:
Japanese Patent JPH10176872
Kind Code:
A
Abstract:

To realize an adsorption heat pump in which a working fluid vapor generating device and an adsorption device for use in adsorbing vapor of working fluid generated from the vapor generating device can be spaced apart from each other.

At an evaporating pipe 16 of a cooling machine 1, working fluid is evaporated and cold heat can be attained. Vapor of working fluid is moved from the evaporating pipe 16 into a first adsorbing device 4 through a communicating pipe 18 and a branch pipe 18a, where it is adsorbed by material 7. In this case, either hydrochlorofluorocarbon or hydrofluorocarbon having a high vapor pressure at a normal temperature is used as working fluid and styrene-divinylbenzen copolymer resin having a high adsorbing characteristic against the working fluid is used as adsorbing material, so that a high pressure gradient may easily be formed between the evaporating pipe 16 and the first absorbing device 4, and vapor of the working fluid may easily be moved from the evaporating pipe 16 to the first adsorbing device 4. Due to this fact, the evaporating pipe 16 and the first absorbing device 4 can be separately spaced apart from each other.


Inventors:
TSUJIMOTO SOICHIRO
Application Number:
JP35344296A
Publication Date:
June 30, 1998
Filing Date:
December 16, 1996
Export Citation:
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Assignee:
OSAKA GAS CO LTD
International Classes:
F25B17/08; (IPC1-7): F25B17/08
Attorney, Agent or Firm:
Tsunehiko Ichikawa