Title:
Ag BALL, Ag CORE BALL, FLUX COAT Ag BALL, FLUX COAT Ag CORE BALL, SOLDER JOINT, FOAM SOLDER, SOLDER PASTE, Ag PASTE AND Ag CORE PASTE
Document Type and Number:
Japanese Patent JP2015147949
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an Ag ball less in α ray amount and high in sphericity even containing an excessive quantity of impurity element other than Ag.SOLUTION: There is provided an Ag ball having the content of U for reducing connection failure by preventing soft errors of 5 ppb or less, the content of Th of 5 ppb or less, purity of 99.9 to 99.9995%, α ray amount of 0.0200 cph/cmor less, the content of any of Pb or Bi and the total content of Pb and Bi of 1 ppm or more, sphericity of 0.90 or more and diameter of 1 to 1000 μm.
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Inventors:
AKAGAWA TAKASHI
KAWASAKI HIROYOSHI
MATSUI KAZUHIKO
KOIKEDA YUICHI
SASAKI MASARU
YAMASAKI HIROYUKI
ROPPONGI TAKAHIRO
SOMA DAISUKE
SATO ISAMU
KAWASAKI HIROYOSHI
MATSUI KAZUHIKO
KOIKEDA YUICHI
SASAKI MASARU
YAMASAKI HIROYUKI
ROPPONGI TAKAHIRO
SOMA DAISUKE
SATO ISAMU
Application Number:
JP2014019718A
Publication Date:
August 20, 2015
Filing Date:
February 04, 2014
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B22F1/102; B22F1/107; B23K35/14; B23K35/22; B23K35/26; C22C5/06; C22C13/00; H01L21/60; H05K3/34
Attorney, Agent or Firm:
Yamaguchi International Patent Office