To obtain an air conditioning device capable of properly performing cooling according to heat generation states of respective function circuits and an air volume of a fan at the cooling of a semiconductor module embedding a plurality of function circuits in one package.
On a heat radiation plate 7, a wide pitch part 7b is formed at a position corresponding to an arrangement region of a first function circuit such that intervals of heat radiation fans are a predetermined value. Further, a narrow pitch part 7a is formed at a position corresponding to an arrangement region of a second function circuit such that the intervals of the heat radiation fans are rendered narrower compared to the wide pitch part 7b. A control device 2 increases an air volume of a fan 3 according to the magnitude of a set operation capacity.
| JP2011078309A | 2011-04-14 | |||
| JP2011220577A | 2011-11-04 | |||
| JP2003110090A | 2003-04-11 | |||
| JP2010236781A | 2010-10-21 | |||
| JP2001085578A | 2001-03-30 | |||
| JP2011017526A | 2011-01-27 | |||
| JP2008060430A | 2008-03-13 |
| US20090052137A1 | 2009-02-26 |
Kiyoshi Yasushima
Takanashi Norio
Motoki Shandong
Taku Ogawa
Murata Kensei
Moto Otani
Kentaro Yokoi