Title:
AIRTIGHT SEALING PACKAGE FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2005244032
Kind Code:
A
Abstract:
To provide an airtight sealing package having high airtight sealing reliability and superior productivity at a low cost.
A first cap 10 is joined to a cavity part 2b constituting a package body by using a sealing member 14 such as solder. Here, in order to attain the state of communicating the inside and outside of the package, the first cap 10 is provided with a through-hole 11 extended in the thickness direction. Then, a photosetting resin is poured into the through-hole 11. Thereafter, the through-hole 11 is closed, by setting the photosetting resin by irradiating it with ultraviolet rays. Further, the through-hole 11 is covered with a second cap 10 jointed to the first cap 10 and a sealing member 15.
Inventors:
ISHIZAKI MITSUNORI
KITAMURA YOICHI
NAKAZATO TAKESHI
KITAMURA YOICHI
NAKAZATO TAKESHI
Application Number:
JP2004053645A
Publication Date:
September 08, 2005
Filing Date:
February 27, 2004
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/02; (IPC1-7): H01L23/02
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai