Title:
微細複製工具を作製するための整列マルチダイヤモンド切削工具組立体及び該切削工具組立体を作製する方法
Document Type and Number:
Japanese Patent JP5833533
Kind Code:
B2
Abstract:
The disclosure is directed to a cutting tool assembly used for creating grooves in a microreplication tool. The cutting tool assembly includes a mounting structure and multiple diamonds aligned in the mounting structure to a tolerance of less than 10 microns. For example, first and second tool shanks having first and second diamond tips can be positioned in the mounting structure such that a cutting location of the first diamond tip is identical to a cutting location of the second diamond tip. However, the second diamond tip may be a defined distance further away from the mounting structure than the first diamond tip, or the second diamond tip may have a different shape than the first diamond tip. In this manner, the first diamond tip may cut a groove into a work piece and the second diamond tip may cut a sub-feature into the groove to create a multi-featured groove.
Inventors:
Tris, Jennifer El.
De Bois, Charles N.
Campbell, Alan Bee.
Enes, Dale El.
De Bois, Charles N.
Campbell, Alan Bee.
Enes, Dale El.
Application Number:
JP2012269551A
Publication Date:
December 16, 2015
Filing Date:
December 10, 2012
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
B23C5/08; B23B27/14; B23B27/20
Domestic Patent References:
| JP2005527394A |
Attorney, Agent or Firm:
Atsushi Aoki
Tetsuro Shimada
Shinji Mitsuhashi
Hirose Shigeki
Kazuo Maejima
Masahiro Tahara
Tetsuro Shimada
Shinji Mitsuhashi
Hirose Shigeki
Kazuo Maejima
Masahiro Tahara