To suppress a volatile component from a photosensitive material applied to a substrate and to stabilize exposure ability by providing a volatile component reduction processing part reducing the volatile component contained in photosensitive substance.

A vacuum processor V1 is installed outside a projection aligner 1. In the vacuum processor V1, a wafer W to which resist is applied by a coater in a previous process is arranged on the preceding stage side of a part loaded on a wafer carrier 13. The wafer carrier 13 transports the wafer W to which resist is applied into the projection aligner 1. The vacuum processor V1 is formed of a container 15 where the wafer W is stored, a vacuum pump 16 for reducing pressure in the container 15 and a controller controlling the operation of the vacuum pump 16. In the vacuum processor V1, the vacuum pump 16 is operated by the controller in a state where the wafer W to which resist is applied is stored in the container 15 and it is kept in the state where pressure is reduced to prescribed one (state approximated to a vacuum state) lower than atmospheric pressure for prescribed time.