Title:
アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
Document Type and Number:
Japanese Patent JP7440356
Kind Code:
B2
Abstract:
The present invention relates to alignment of substrates cut from a large substrate. An objective of the present invention is to suppress the effect of measurement precision caused by differences between cut portions. An alignment apparatus comprises: a substrate support means of supporting substrates obtained by dividing a large substrate; a distance adjustment means of adjusting the distance in the gravitational direction between a mask support means of supporting a mask and the substrate support means; a measurement means of performing a measurement operation of measuring a position misalignment amount of the substrates and the mask; and a position adjustment means of performing a position adjustment operation of adjusting the relative position of the mask and the substrates. If the position misalignment amount is within an allowed range, the alignment apparatus overlaps the substrates and the mask. The measurement operation is performed after adjusting the distance between the substrates and the measurement means based on substrate information on portions of the substrates in the large substrate before division.
Inventors:
Yasunobu Kobayashi
Kazunori Tani
Kazunori Tani
Application Number:
JP2020110571A
Publication Date:
February 28, 2024
Filing Date:
June 26, 2020
Export Citation:
Assignee:
Canon Tokki Corporation
International Classes:
C23C14/24; C23C14/04; H01L21/68; H01L21/683; H05B33/10; H10K50/10
Domestic Patent References:
| JP2019083311A | ||||
| JP2016135555A |
Attorney, Agent or Firm:
Patent Attorney Corporation Otsuka International Patent Office
Yasunori Otsuka
Yasuhiro Ohtsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Yukimitsu Nagakawa
Tomotake Ogawa
Ryo Okawa
Yasunori Otsuka
Yasuhiro Ohtsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Yukimitsu Nagakawa
Tomotake Ogawa
Ryo Okawa