Title:
アライメント方法
Document Type and Number:
Japanese Patent JP7088771
Kind Code:
B2
Abstract:
An objective of the present invention is to quickly find an alignment mark when a line to be divided is specified. An alignment method photographs a wafer (W) with a device (D) formed in an area divided by a first line (S1) to be divided and a second line (S2) to be divided by a photographing means (51), detects an alignment mark (MA), and specifies the first line to be divided (S1) and the second line to be divided (S2). The alignment method comprises: a process of registering a target image (GT) including an alignment mark (MA) of a smaller area than a photographing area (510) of the photographing means (51) smaller than the area; and a process of coupling at least two photographed images of a horizontal array obtained by photographing the wafer (W) retained on a table (30) by the photographing means (51) to form a coupled image, and checking whether the target image (GT) is present in the coupled image by pattern matching whenever the coupled image is formed. After the target image (GT) is detected, the first line to be divided (S1) and the second line to be divided (S2) are specified from the alignment mark (MA) in the target image (GT).
Inventors:
Satoshi Miyata
Application Number:
JP2018140157A
Publication Date:
June 21, 2022
Filing Date:
July 26, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B27/06; B24B49/12; H01L21/68; H01L21/683
Domestic Patent References:
| JP2010010539A | ||||
| JP2016157870A | ||||
| JP7042131U | ||||
| JP2008141018A | ||||
| JP2004279332A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
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