Title:
IMPRINTING/EMBOSSING ALIGNMENT SYSTEM
Document Type and Number:
Japanese Patent JP2005205915
Kind Code:
A
Abstract:
To provide an imprinting/embossing alignment system.
The imprinting/embossing alignment system is equipped with a die having a base, the embossing foil arranged on the base and a cylinder having the rod part piercing the central part of the die and receiving a substrate. This system is also equipped with the ball bushing arranged around the rod part and the annular part arranged between the ball bushing and the embossing foil to keep the accurate alignment of the center line of the rod part and the center line of the embossing foil.
Inventors:
HAPPER BRUCE M
SAITO TOSHIYUKI MAX
SAITO TOSHIYUKI MAX
Application Number:
JP2005013161A
Publication Date:
August 04, 2005
Filing Date:
January 20, 2005
Export Citation:
Assignee:
KOMAG INC
International Classes:
B29C33/30; B29C33/42; B65G57/22; G11B5/84; G11B7/26; B29L17/00; (IPC1-7): B29C33/30; B29C33/42; G11B5/84
Domestic Patent References:
JPS5836417A | 1983-03-03 | |||
JP2002251784A | 2002-09-06 | |||
JPH08124223A | 1996-05-17 | |||
JPH07186194A | 1995-07-25 | |||
JP2003291178A | 2003-10-14 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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