Title:
ALKALI-SOLUBLE MODIFIED RESIN
Document Type and Number:
Japanese Patent JP3624326
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an alkali soluble modified resin which has a specific chemical structure, a specific softening point and an acid value, can be removed by washing with an alkaline aqueous solution in no need of an organic solvent and is suitable for a tentative adhesive, a protecting layer or the like in the production of wafer.
SOLUTION: This modified resin has a softening point of 60-120°C, an acid value of 80-200mg KOH/g and the chemical structure represented by formula I or formula II (X is a 1-5C aromatic, univalent aliphatic or polycarboxylic acid residue; R1 is H, a 1-10C; R2 is a 1-110C alkyl-substituted phenyl, a 1-10C alkyl which may have an ether bond in the molecule; (n) is 0≤n≤10, preferably 0≤n<5).
Inventors:
Chiaki Asano
Takuwa Seigo
Yoshimoto Hobun
Takuwa Seigo
Yoshimoto Hobun
Application Number:
JP22763695A
Publication Date:
March 02, 2005
Filing Date:
September 05, 1995
Export Citation:
Assignee:
Toto Kasei Co., Ltd.
International Classes:
C08G59/14; C08G59/08; (IPC1-7): C08G59/14
Domestic Patent References:
| JP1253729A | ||||
| JP6228252A | ||||
| JP6240110A | ||||
| JP6263832A | ||||
| JP7036183A | ||||
| JP61285219A |
Attorney, Agent or Firm:
Hiroshi Tanaka
Eishiro Higuchi
Eishiro Higuchi