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Title:
ALKALI-SOLUBLE RESIN, POSITIVE-TYPE RESIST COMPOSITION AND NEGATIVE-TYPE RESIST COMPOSITION EACH USING THE SAME
Document Type and Number:
Japanese Patent JP2010077380
Kind Code:
A
Abstract:

To provide an alkali-soluble resin having such high alkali solubility as to be suitable for resist compositions, and capable of forming a highly heat-resistant cured product with high resolution without generating low-molecular components including water in its heat treatment process, and to provide a positive-type resist composition and a negative-type resist composition each using the alkali-soluble resin.

The alkali-soluble resin having a benzoxazine ring's ring-opened structure is provided. The resin includes repeat units each of which is made by alternate copolymerization between a benzoxazine ring-bearing compound and an aromatic compound having one or more phenolic hydroxy groups on one of the benzene rings. The resin has a fundamental combination of characteristics inherent in benzoxazine resins including electrical insulation, mechanical strength, flame retardancy and water resistance, and expresses high alkali solubility derived from phenolic hydroxy group-bearing compounds.


Inventors:
KOBAYASHI SAYAKA
SUEZAKI MINORU
RI YOSHU
NAKAMURA MASANORI
Application Number:
JP2009022993A
Publication Date:
April 08, 2010
Filing Date:
February 03, 2009
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G14/06; G03F7/023; G03F7/037
Attorney, Agent or Firm:
Atomi International Patent Office