Title:
基板の洗浄またはエッチングに用いられるアルカリ性水溶液組成物
Document Type and Number:
Japanese Patent JP5142592
Kind Code:
B2
Abstract:
As a washing liquid and an etching solution for semiconductor substrates and glass substrates, alkaline aqueous solutions are used; however, since metal impurities are adsorbed on the substrate surface during processing, a next process for removing the adsorbed metal impurities is required. In addition, when a washing liquid is used, it cannot wash off metal impurities; therefore an acid washing process is required. The present invention provides an aqueous solution composition, which is an alkaline aqueous solution but is able to prevent adsorption of metal impurities, which also has cleaning capability. By means of an alkaline aqueous solution composition used for washing or etching a substrate, the composition comprising a chelating agent represented by the general formula (1): and an alkaline component, the adsorption of metal impurities on the substrate is prevented, and metal impurities adsorbed on the substrate are washed off.
Inventors:
Norio Ishikawa
Application Number:
JP2007150353A
Publication Date:
February 13, 2013
Filing Date:
June 06, 2007
Export Citation:
Assignee:
Kanto Chemical Co., Ltd.
International Classes:
H01L21/308; C09K13/06; C11D3/04; C11D3/26; C11D7/06; C11D7/32; H01L21/304
Domestic Patent References:
| JP2004014813A | ||||
| JP10265798A | ||||
| JP8283754A |
Attorney, Agent or Firm:
Kiyoji Kuzuwa