To provide a curable composition allowing formation of a cured film excellent in developability as well as excellent in various characteristics such as hardness, solder heat resistance, chemical resistance, adhesiveness, PCT (pressure cooker test) durability, electroless plating durability, whitening resistance, electric insulating property and flexibility.
The alkali-developable curable composition contains: (A) a carboxyl group-containing resin having an acid value of 20 to 200 mgKOH/g and soluble with an organic solvent, the resin obtained by reacting an epoxy group of a resin (a) having two or more epoxy groups in one molecule with one or more kinds of monocarboxylic acids (b) in a proportion of 0.3 to 0.8 mol per one equivalent of the epoxy group to obtain a reaction product (c) and further reacting an epoxy group of the reaction product (c) with a polybasic acid (d) in a proportion of 1 to 5 mol per one equivalent of the epoxy group; (B) a photosensitive (meth)acrylate compound; and (C) a photopolymerization initiator.
COPYRIGHT: (C)2010,JPO&INPIT
Kobinoyama Noboru
Koichi Ikegami
Teppei Nishikawa
Chika Eiko
Tomoya Higuchi
Hiroko Daido
Takuya Kubo
| JP3238456A | ||||
| JP10101770A | ||||
| JP6166843A | ||||
| JP5178950A | ||||
| JP4165358A | ||||
| JP9080749A | ||||
| JP2009280726A | ||||
| JP2009269954A |
Ryouhei Kobayashi
Makiko Ichioka