Title:
アルカリ分散型ホットメルト粘着剤
Document Type and Number:
Japanese Patent JP7438742
Kind Code:
B2
Abstract:
The object of the present invention is to provide an alkali-dispersible hot melt pressure-sensitive adhesive which (i) has a high alkali-dispersibility, (ii) is excellent in strength to retain the label, (iii) hardly causes an adhesive residue problem and (iv) is capable of reducing stringing. The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B) a tackifier resin and (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, wherein the thermoplastic block copolymer (A) comprises (A1) a styrene-based block copolymer having a styrene content of less than 40 mass % and the tackifier resin (B) comprises an α-methylstyrene-based resin.
Inventors:
Ai Takamori
Application Number:
JP2019225596A
Publication Date:
February 27, 2024
Filing Date:
December 13, 2019
Export Citation:
Assignee:
Henkel Japan Co., Ltd.
International Classes:
C09J153/02; C09J11/06; C09J11/08; C09J125/16
Domestic Patent References:
| JP2016060847A | ||||
| JP2010531908A | ||||
| JP2013194108A |
Foreign References:
| WO2018115789A1 |
Attorney, Agent or Firm:
Katsuhiro Ito
Previous Patent: semiconductor process sheet
Next Patent: Aluminum nitride wiring board and its manufacturing method
Next Patent: Aluminum nitride wiring board and its manufacturing method