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Title:
アルケニル基含有樹脂、硬化性樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP6963565
Kind Code:
B2
Abstract:
The present invention provides: an alkenyl-group-containing resin, a cured article thereof having exceptional low moisture absorbency (low water absorbency) and heat resistance; a curable resin composition; and a cured article thereof. In this alkenyl-group-containing resin, which is represented by formula (1), 20% or more of the alkenyl groups in the plurality of X and Y moieties are propenyl groups. (In the formula, the plurality of Z moieties each independently represent a C6-15 hydrocarbon group. The plurality of X moieties each independently represent a hydrogen atom, a C1-6 alkyl group, an allyl group, a propenyl group, or a glycidyl group, excluding when all of the plurality of X moieties are hydrogen atoms or allyl groups. The plurality of Y moieties each independently represent a hydrogen atom, a C1-6 alkyl group, an allyl group, or a propenyl group. N represents the number of repetitions, and the average value thereof is a real number of 1 to 20)

Inventors:
Kenichi Kubogi
Kazuki Matsuura
Application Number:
JP2018559119A
Publication Date:
November 10, 2021
Filing Date:
December 21, 2017
Export Citation:
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Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08G61/02; C08K5/3445; C08L65/00
Domestic Patent References:
JP2012017423A
JP2014169428A
Foreign References:
WO2016002704A1
Attorney, Agent or Firm:
Shinei Patent Office