Title:
ALLOY POWDER FOR DEPOSITION MODELING, DEPOSITION MODEL, AND DEPOSITION MODELING METHOD
Document Type and Number:
Japanese Patent JP2022106532
Kind Code:
A
Abstract:
To improve high-temperature creep ductility in deposition modeling of Ni-based alloys.SOLUTION: An alloy powder for deposition modeling according to one embodiment of the present invention is configured from a nickel-based alloy and contains 15.0 mass% or more and 25.0 mass% or less of cobalt, 10.0 mass% or more and 25.0 mass% or less of chromium, 0.0 mass% or more and 3.5 mass% or less of molybdenum, 0.5 mass% or more and 10.0 mass% or less of tungsten, 1.0 mass% or more and 4.0 mass% or less of aluminum, 0.0 mass% or more and 5.0 mass% or less of titanium, 0.0 mass% or more and 4.0 mass% or less of tantalum, 0.0 mass% or more and 2.0 mass% or less of niobium, 0.03 mass% or more and 0.2 mass% or less of carbon, 0.003 mass% or more and 0.05 mass% or less of boron, and 0.1 mass% or more and 0.3 mass% or less of zirconium.SELECTED DRAWING: Figure 2
Inventors:
TANEIKE MASAKI
TANIGAWA HIDETSUGU
KITAMURA HITOSHI
TAKEDA YASUNARI
TANIGAWA HIDETSUGU
KITAMURA HITOSHI
TAKEDA YASUNARI
Application Number:
JP2021001605A
Publication Date:
July 20, 2022
Filing Date:
January 07, 2021
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
C22C19/05; B22F1/00; B22F3/16; B33Y10/00; B33Y70/00; B33Y80/00; C22C30/00
Attorney, Agent or Firm:
SSIP Patent Attorney Corporation
Previous Patent: How to learn rolling model
Next Patent: Method for producing release layer forming composition and release film
Next Patent: Method for producing release layer forming composition and release film