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Title:
ALLOY FOR THERMAL FUSE
Document Type and Number:
Japanese Patent JP2007113050
Kind Code:
A
Abstract:

To provide an alloy for thermal fuse operating at about 100°C which is free from Cd and Pb adversely affecting a human body and also is decreased in a difference between a solidus temperature and a peak temperature and further has excellent workability.

As the alloy for thermal fuse for use at 95 to 105°C fusing temperature, an alloy for thermal fuse having a composition consisting of, by mass, 51 to 53% In, 6 to 8% Bi, 0.5 to 1.5% Zn and the balance Sn is used. In order to suppress the change with the lapse of time, ≤0.05 mass%, in total, of Al, Ge and Ga can be added. The alloy for thermal fuse is free from Cd and Pb adversely affecting a human body, and further, the difference between the solidus temperature and the peak temperature which determines the operability of the thermal fuse is small. Moreover, because of its elongation, the alloy for thermal fuse is highly advantageous in workability into a fine wire.


Inventors:
Onishi, Tsukasa
Application Number:
JP2005000304407
Publication Date:
May 10, 2007
Filing Date:
October 19, 2005
Export Citation:
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Assignee:
SENJU METAL IND CO LTD
International Classes:
C22C28/00; H01H37/76