Title:
ALLOY VIA PASTE AND METHOD OF MANUFACTURING WIRING BOARD USING ALLOY VIA PASTE
Document Type and Number:
Japanese Patent JP2015032806
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of responding to the need for lead-free.SOLUTION: In a wiring board having a via hole conductor, the via hole conductor includes a metal portion and a resin portion. The metal portion has a first metal region, a second metal region and a third metal region, where copper particles forming an aggregate form a surface contact part by coming into surface contact with each other, and at least a part of the second metal region is in contact with the first metal region, in the alloy via paste for wiring board. The alloy via paste has any one or more of liquid components of at least copper particles having a first reactive adsorption layer on the surface, Sn-Bi solder particles having a second reactive adsorption layer on the surface, and a liquid reactive resin or liquid organic solvent.
Inventors:
NAKAMURA SADASHI
HIMORI GOJI
KOMATSU SHINGO
ECHIGO FUMIO
HIMORI GOJI
KOMATSU SHINGO
ECHIGO FUMIO
Application Number:
JP2013163882A
Publication Date:
February 16, 2015
Filing Date:
August 07, 2013
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H05K1/09; H01B1/00; H01B1/22; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Hiroki Naito
Fujii Kentaro
Terauchi Italian 久郎
Fujii Kentaro
Terauchi Italian 久郎