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Title:
ALLYL GROUP-CONTAINING RESIN, METHOD FOR PRODUCING THE SAME, MALEIMIDE CURING AGENT, THERMOSETTING MOLDING MATERIAL, AND SEMICONDUCTOR SEALING MATERIAL
Document Type and Number:
Japanese Patent JP2018065932
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an allyl group-containing resin capable of curing a maleimide compound in a short gel time and giving a cured product excellent in adhesion.SOLUTION: The allyl group-containing resin has: either or both of a constituent unit (1) represented by formula (1) and a constituent unit (2) represented by formula (2); and at least a constituent unit (4) represented by formula (4) out of a constituent unit (3) represented by formula (3) and the constituent unit (4). The total content of the constituent units (2) and (4) is 10-100 mol% based on the total of the constituent units (1), (2), (3) and (4). (Ar is a benzene ring or a naphthalene ring.)SELECTED DRAWING: None

Inventors:
AMANO TATSU
ABE YUKIO
Application Number:
JP2016205317A
Publication Date:
April 26, 2018
Filing Date:
October 19, 2016
Export Citation:
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Assignee:
GUNEI CHEMICAL IND CO LTD
International Classes:
C08G12/06; C08F290/14; C08G10/04; H01L23/29; H01L23/31
Domestic Patent References:
JP2017119830A2017-07-06
JP2018065931A2018-04-26
JP2017115035A2017-06-29
JP2017036365A2017-02-16
JP2016027101A2016-02-18
JPS5236188A1977-03-19
Attorney, Agent or Firm:
Masatake Shiga
Yoshifumi Saeki
Noriko Yanai