Title:
アルミニウム-セラミックス接合基板およびその製造方法
Document Type and Number:
Japanese Patent JP4821013
Kind Code:
B2
Inventors:
Hideyo Koyamauchi
Application Number:
JP2003337106A
Publication Date:
November 24, 2011
Filing Date:
September 29, 2003
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
B22D19/00; C22C21/00; H01L23/14; H05K1/02; H05K7/20
Attorney, Agent or Firm:
Koichi Okawa