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Title:
アルミニウム-セラミックス接合体
Document Type and Number:
Japanese Patent JP4133170
Kind Code:
B2
Abstract:
A combined member of aluminum-ceramics comprises a ceramic board (1), a conductive member (2) holding electronic parts and formed on one surface of the ceramic board, and a heat radiating member (3) of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.

Inventors:
Hideyo Koyamauchi
Mutsumi Namioka
Ken Iyoda
Application Number:
JP2002283440A
Publication Date:
August 13, 2008
Filing Date:
September 27, 2002
Export Citation:
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Assignee:
DOWA Holdings Co., Ltd.
International Classes:
B22D19/00; C04B37/02; H01L23/36; H01L23/373; H01L23/40; H01L23/473; H05K1/02; H05K7/20
Domestic Patent References:
JP7276035A
JP7193358A
JP11346480A
Attorney, Agent or Firm:
Seiichi Sawaki
Kiichi Sawaki



 
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