Title:
ALUMINUM-COPPER-SILICON ALLOY MATERIAL FOR THIXOCASTING
Document Type and Number:
Japanese Patent JP2794540
Kind Code:
B2
Abstract:
PURPOSE: To produce an Al-Cu-Si alloy material capable of forming a sound Al alloy casting by a thixocasting method.
CONSTITUTION: The Al-Cu-Si alloy material for thixocasting gives, at differential scanning calorimetry, a thermogram (f) having a first conical endothermic section (g) by the melting of eutectic CuAl2 and a second conical endothermic section (h) by the melting of primary-crystal α-Al. In this material, Si content is set at 0.01-1.5wt.%. By this procedure, the slope of an ascending line segment (k) of the second conical endothermic section (h) is made gradual and the gel state of solid phases can be maintained for a relatively long time, and as a result, the property of joining among mutual solid phases and between solid phases and liquid phases can be improved. Further, in the first conical endothermic section (g), the slope of an ascending line segment (o) is made steep and the viscosity of the finally solidified part of the liquid phases can be held low, and as a result, the liquid phases can be supplied sufficiently around the solid phases according to the solidification and contraction of the solid phases.
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Inventors:
NAKAMURA TAKEYOSHI
SAITO NOBUHIRO
SAITO NOBUHIRO
Application Number:
JP27560594A
Publication Date:
September 10, 1998
Filing Date:
October 14, 1994
Export Citation:
Assignee:
HONDA GIKEN KOGYO KK
International Classes:
B22D17/00; B22D17/30; B22D21/04; C22C1/02; C22C21/00; C22C21/12; (IPC1-7): C22C21/12; C22C21/00
Domestic Patent References:
| JP7316709A | ||||
| JP8109430A |
Attorney, Agent or Firm:
Ken Ochiai (1 person outside)
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