Title:
アルミニウム−ダイヤモンド系複合体及びその製造方法
Document Type and Number:
Japanese Patent JP6755879
Kind Code:
B2
Abstract:
The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor element, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element. Provided is a flat plate-shaped aluminum-diamond composite that has an aluminum-diamond composite part and a surface layer that coats both surfaces of the composite part and includes a metal that has aluminum as a principal component, wherein: the composite part is composed of a composite material that is composed of an aluminum or aluminum alloy matrix and diamond particles dispersed in said matrix; the composite material is composed of a diamond powder in which diamond particles having a particle size of 1-20 μm, inclusive, make up 10-40 vol % of the diamond particles and diamond particles having a particle size of 100-250 μm, inclusive, make up 50-80 vol %, said powder not containing diamond particles having a particle size of less than 1 μm or diamond particles having a particle size of more than 250 μm; and the average value for the differences in in-plane thickness per 50 mm×50 mm is 100 μm or less.
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Inventors:
Hiroo Ota
Takeshi Miyagawa
Yosuke Ishihara
Takeshi Miyagawa
Yosuke Ishihara
Application Number:
JP2017545200A
Publication Date:
September 16, 2020
Filing Date:
October 11, 2016
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
C22C1/10; C22C21/00; C22C21/02; C22C26/00; H01L23/373
Domestic Patent References:
| JP2012117085A |
Foreign References:
| WO2013015158A1 | ||||
| WO2010007974A1 | ||||
| US20120063071 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation