Title:
ALUMINUM ELECTROPLATING BATH
Document Type and Number:
Japanese Patent JPH0445298
Kind Code:
A
Abstract:
PURPOSE:To obtain an Al electroplating bath forming a smooth Al plating layer having denseness up to the surface and enabling uniform plating even at a low current density by adding a specified arom. compd. and a polymer to a plating bath prepd. by melting a mixture of an aluminum halide with an onium salt of a nitrogen-contg. heterocyclic compd. CONSTITUTION:When an arom. compd. having nitrogen atoms is added to a plating bath prepd. by melting a mixture of 40-80mol% aluminum halide with 20-60mol% onium halide of a nitrogen-contg. heterocyclic compd. and the resulting plating bath is used, a plating layer having metallic luster and a smooth surface is formed even in the case of thick plating. Throwing power is improved by further adding a polymer. The above-mentioned onium halide is an onium compd. obtd. by converting a nitrogen atom in a nitrogen-contg. heterocyclic compd. contg. nitrogen besides carbon as ring forming atoms into a cation and bonding halide anions to the cation by coordination.
Inventors:
TAKAHASHI SETSUKO
SAEKI ISAO
KURASAWA AKIRA
MORIAKI ICHIROU
IDA KAZUHIKO
SUZUKI HITOSHI
SAEKI ISAO
KURASAWA AKIRA
MORIAKI ICHIROU
IDA KAZUHIKO
SUZUKI HITOSHI
Application Number:
JP15219090A
Publication Date:
February 14, 1992
Filing Date:
June 11, 1990
Export Citation:
Assignee:
NISSHIN STEEL CO LTD
MITSUBISHI PETROCHEMICAL CO
MITSUBISHI PETROCHEMICAL CO
International Classes:
C25D3/66; (IPC1-7): C25D3/66
Attorney, Agent or Firm:
Mitsuru Shindo
Next Patent: JPH0445299