Title:
ALUMINUM ELECTROPLATING METHOD WITH NONAQUEOUS SOLUTION
Document Type and Number:
Japanese Patent JPH01104794
Kind Code:
A
Abstract:
PURPOSE:To increase the rate of electroplating by safe work by using a molten salt bath consisting of AlCl3 and butylpyridinium chloride and by specifying the interval between the anode and a material to be plated, the temp. of the bath and current density. CONSTITUTION:A molten salt bath consisting of AlCl3 and butylpyridinium chloride is prepd. or an org. solvent is added to the bath to prepare an electrolytic soln. This plating soln. is used, the interval between the anode and a material to be plated is regulated to 4-30mm and the material is electroplated at 0-150 deg.C temp. of the bath and 0.5-30A/dm<2> current density in an inert gaseous atmosphere. When a strip is continuously plated by a horizontal plating system, the transverse direction of the strip is preferably allowed to coincide with the perpendicular direction of a cell.
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Inventors:
TAKAHASHI SETSUKO
MORI KUMIKO
AKIMOTO KIKUKO
AKAMA RYOZO
MORI KUMIKO
AKIMOTO KIKUKO
AKAMA RYOZO
Application Number:
JP26049487A
Publication Date:
April 21, 1989
Filing Date:
October 15, 1987
Export Citation:
Assignee:
NISSHIN STEEL CO LTD
International Classes:
C25D3/66; (IPC1-7): C25D3/66
Attorney, Agent or Firm:
Shindo Mitsuru