Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
AMBIENT TEMPERATURE-CURABLE POLYMER COMPOSITION AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2009215521
Kind Code:
A
Abstract:

To provide an ambient temperature-curable polymer composition having good hardenability and adhesion, containing a low out-gas content, and being suitable as sealing materials for clean rooms, for example.

The ambient temperature-curable polymer composition includes (A) a polyoxyalkylene polymer wherein the main chain substantially includes polyoxypropylene and has a reactive silicon-containing group at an end of the main chain, (B) a curing catalyst, (C) an inorganic filler substantially containing no alkalimetal salt of fatty acid, (D) alkoxy silane and/or a hydrolyzed, condensed product thereof, and (E) hindered amine or hindered phenol antioxidant having a melting point of 20C or higher and 120C or lower or vaporization pressure at 20C of 1.110-3Pa or less, wherein the BHT content is 2 ppm or less to the total.


Inventors:
Ono, Kazuhisa
Application Number:
JP2008000063726
Publication Date:
September 24, 2009
Filing Date:
March 13, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MOMENTIVE PERFORMANCE MATERIALS INC
International Classes:
C08L71/02; C08K3/00; C08K5/13; C08K5/3435; C08K5/5419; C08L71/00; C08K3/00; C08K5/00