Title:
アミドイミド樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
Document Type and Number:
Japanese Patent JP7310253
Kind Code:
B2
Abstract:
To provide an amide-imide resin composition which has excellent alkali developability and high photosensitivity, and excellent heat resistance and base material adhesion, a curable resin composition containing the same, and a cured product, an insulating material, and a resin material for solder resist formed of the curable resin composition, and a resist member.SOLUTION: An amide-imide resin composition contains an amide-imide resin (A) having an acid group and a polymerizable unsaturated group, and an amide-imide resin (B) other than the amide-imide resin (A), in which the amide-imide resin (A) contains an amide-imide resin (a1) having an acid group and/or an acid anhydride group and a hydroxyl group-containing (meth)acrylate compound (a2) as essential reaction raw materials.SELECTED DRAWING: None
Inventors:
Shunsuke Yamada
Kosuke Kuwata
Kosuke Kuwata
Application Number:
JP2019080004A
Publication Date:
July 19, 2023
Filing Date:
April 19, 2019
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08L55/00; C08F290/14; C08G18/34; C08G18/75; C08G18/79; C08L79/08; G03F7/038; H05K3/28
Domestic Patent References:
| JP2001316436A | ||||
| JP2018109733A | ||||
| JP2018197359A | ||||
| JP8283356A | ||||
| JP63317553A |
Foreign References:
| WO2018230144A1 | ||||
| CN102925089A |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno
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