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Patent Searching and Data


Title:
AMINO RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS6257454
Kind Code:
A
Abstract:

PURPOSE: The titled molding material, obtained by incorporating a reinforcing material containing inorganic fibers and organic fibers together with an in organic filler, having reduced after-shrinkage and improved rigidity without causing a doming phenomenon.

CONSTITUTION: An amino resin molding material obtained by adding an inorganic fibers and organic fibers together as a reinforcing material and an inorganic filler, curing agent, mold releasing agent, colorant, etc., as a filler to an amino resin. The reinforcing material is obtained by mixing 10W20wt%, based on the total of the resin, reinforcing material and filler, inorganic fibers, e.g. glass fibers asbestos fibers with 10W20wt%, based on the total of the resin, reinforcing material and filler, organic fibers, e.g. pulp or polyamide fibers. The inorganic filler has 6W8 pH and burnt alum, etc., may be used as the inorganic filler. The amount thereof to be incorporated is 20W30wt%.


Inventors:
YOKOYAMA MASAYUKI
Application Number:
JP19657385A
Publication Date:
March 13, 1987
Filing Date:
September 05, 1985
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L61/00; C08K3/00; C08K7/02; C08K13/04; C08L61/20; C08L67/00; C08L77/00; (IPC1-7): C08K3/00; C08K7/02; C08K13/04; C08L61/20
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)