Title:
両親媒性ブロックコポリマー強化熱硬化樹脂
Document Type and Number:
Japanese Patent JP5698324
Kind Code:
B2
Abstract:
A composition comprising (1) a thermosettable resin selected from the group consisting of an epoxy resin, an epoxy vinyl ester resin, an unsaturated polyester resin or a mixture thereof, and (2) an amphiphilic mock copolymer dispersed in the thermosettable resin; fiber-reinforced plastics (FRP), coatings and composites prepared therefrom; and methods of preparing these.
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Inventors:
Bergese, Kandasil Epen
Bates, Frank S.
Fan, Hakyu.
White, Jerry E.
Bates, Frank S.
Fan, Hakyu.
White, Jerry E.
Application Number:
JP2013184805A
Publication Date:
April 08, 2015
Filing Date:
September 06, 2013
Export Citation:
Assignee:
Dow Global Technologies LLC
University of Minnesota
University of Minnesota
International Classes:
C09D163/10; C08L53/00; C08L63/00; C08L63/10; C08L67/06; C09D5/03; C09D153/00; C09D167/06; C09D171/02; C09D201/00
Domestic Patent References:
| JP49111993A | ||||
| JP11209558A | ||||
| JP2006527278A |
Other References:
DEAN J.M.,JOURNAL OF POLYMER SCIENCE, PART B, POLYMER PHYSICS,2001年12月 1日,V39 N23,P2996-3010
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Atsushi Ebiya
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Atsushi Ebiya