Anisotropic conductive adhesive, a luminescent device, and a manufacturing method of anisotropic conductive adhesive

Japanese Patent JP5985414

B2

Provided is a light emitting device high in the intensity of emitted light. A blue LED chip (20) having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate (11) by an anisotropic conductive adhesive (12). A light reflecting layer made of a silver alloy on a surface of each conductive particle (1) contained in the anisotropic conductive adhesive (12), and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % and at most 3.0 weight % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 weight % with respect to the total weight of Ag, Bi, and Nd of 100 weight %. The conductive particle has high anti-migration properties.

JPS6220579	THERMALLY ACTIVE ADHESIVE FOR PRINTED WIRING BOARD
JP2022143454	SUPPORT SHEET, COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION, AND METHOD FOR MANUFACTURING APPARATUS
WO/2004/019421	SOLAR PANEL INCLUDING A LOW MOISTURE VAPOR TRANSMISSION RATE ADHESIVE COMPOSITION

Hideji Hagi
Shigeyuki Kanizawa
Hideaki Magoshi
Masaharu Aoki
Akira Ishigami

JP2013029868A

September 06, 2016

February 19, 2013

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Dexerials Co., Ltd.

C09J201/00; C09J9/02; C09J11/04; C23C14/34; H01B1/00; H01B1/20; H01L21/60; H01L33/62

JP2012178400A
JP201165958A
JP200313021A
JP2010129472A
JP2012209148A
JP2010225572A
JP201227224A

WO2013051708A1

Shigeo Ishijima
Hideki Abe

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