To provide an anisotropic conductive adhesive tape having high adhesion strength, enabling anisotropically conductive bonding of two wiring boards and giving an anisotropic conductive bonded circuit board keeping stable insulation properties and conductive properties even after the exposure of the board to wet heat conditions and provide a bonded wiring board member.
The anisotropic conductive adhesive tape is produced by casting a coating liquid containing (A) an acrylic binder resin containing an acetoacetoxy group, (B) a monofunctional reactive diluent, (C) a polyfunctional oligomer, (D) a silane coupling agent, (E) a thermal polymerization initiator and (F) a conductive filler. A β-dikenone structure capable of forming a 6-membered ring structure together with a metal in the adherend is formed in the adhesive layer of the anisotropic conductive adhesive tape. The anisotropic conductive bonded wiring board is produced by the anisotropic conductive bonding of two wiring boards with the anisotropic conductive adhesive tape.
SUWA TATSUHIRO
Koji Makimura
Chihata Takahata
Toru Suzuki