Title:
異方性導電フィルム、接合体、及び接合体の製造方法
Document Type and Number:
Japanese Patent JP5823117
Kind Code:
B2
Abstract:
An anisotropic conductive film for electrically connecting a first circuit member to a second circuit member, the first circuit member having an insulating film formed in at least part thereof. The anisotropic conductive film comprises a layer which contains electroconductive particles and an insulating adhesion layer formed from an insulating adhesive, the insulating adhesion layer having an average thickness of 0.5-3 µm and giving, upon curing, a cured object which has a storage modulus measured at 30ºC of 500-1,500 MPa.
Inventors:
Shinichi Hayashi
Shinichi Sato
Hiroshi Hamachi
Shinichi Sato
Hiroshi Hamachi
Application Number:
JP2010256057A
Publication Date:
November 25, 2015
Filing Date:
November 16, 2010
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01R11/01; C09J7/22; C09J9/02; C09J201/00; H01B5/14; H01B5/16; H01R43/00; H05K1/14; H05K3/36
Domestic Patent References:
| JP2008288551A | ||||
| JP2005166438A |
Foreign References:
| WO2010010743A1 |
Attorney, Agent or Firm:
Koichi Hirota