Title:
ANISOTROPIC CONDUCTIVE FILM BONDING DEVICE
Document Type and Number:
Japanese Patent JP3402636
Kind Code:
B2
Abstract:
PURPOSE: To separate adhesion without heating an anisotropic conductive film by a method wherein, when an anisotropic conductive film is pressed by a pressing body, notches are formed ton, the boundary section between the part adhered to a board and the non-adhered part of the amorphous conductive film by giving shearing action by pressing the boundary part to the edge corner of the board utilizing pressing force.
CONSTITUTION: The part of an elastic body 2, protruding from the lower part of a board 42, is pressed from upper side by both end parts of a pressing body 1. Both end parts of an anisotropic conductive film 47, which are elastically deformed and protruding from the lower part of the substrate 42, are pressed downward by the elastic body 2. As a result, shearing force works on both ends of the anisotropic conductive film 47 between the elastic body 2 and the edge corner A on the upper surface of the lower part of the board 42, and a notch can be formed on the boundary between the part of the anisotropic conductive film 47 adhered to the electrode 44 of the lower part of the board 42 and the part of the anisotropic conductive film 47 protruding from the lower part of the board 42. Accordingly, the non-adhered part can be separated by pulling it by hand without heating the anisotropic conductive film.
Inventors:
Masaki Hamayoshi
Seiko Fukushima
Seiko Fukushima
Application Number:
JP33724192A
Publication Date:
May 06, 2003
Filing Date:
December 17, 1992
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H05K3/36; H05K3/32; (IPC1-7): H05K3/32; H05K3/36
Domestic Patent References:
| JP1117284A |
Attorney, Agent or Firm:
Takehiko Suzue
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