ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

Title:

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

Document Type and Number:

Japanese Patent JP2012099404

Kind Code:

A

Abstract:

To provide a highly reliable anisotropic conductive film excellent in chip crack resistance and chip peeling resistance and also excellent in connection reliability, and a connection structure using the anisotropic conductive film.

The anisotropic conductive film includes at least two layers, and has a minimum interlaminar fracture strength after hardening of 2 to 9 MPa.

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Inventors:

OTANI AKIRA
IKEDA KAZUMASA
KIZAKI YOICHI

Application Number:

JP2010247618A

Publication Date:

May 24, 2012

Filing Date:

November 04, 2010

Export Citation:

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Assignee:

ASAHI KASEI E MATERIALS CORP

International Classes:

H01R11/01; H01B5/16; H01L21/60; H01R43/00; H05K3/32

Attorney, Agent or Firm:

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hiroyuki Onoda
Toko Saito
Shunsuke Mima

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