To obtain the anisotropic conductive film for an IC card which can be connected in a short time at low temperature under low pressure, has a small number of voids between an LSI chip and a substrate after the chip is mounted, and is reliable in an environment test by incorporating copper alloy conductive powder in the anisotropic conductive film and specifying the quantity of the gap present between the substrate and LSI chip.
The anisotropic conductive film arranged between the IC card substrate and the LSI chip connected to the substrate contains the copper alloy conductive powder and the gap present between the substrate and LSI chip is ≤40%. The copper alloy conductive powder is represented as AxCu1-x (A is ≥1 kind selected between Ag and Au and 0.001≤X≤0.6 in an atomic ratio), the silver or gold density of the powder surface is larger than mean silver or gold density, and the mean particle size is 2 to 20 microns. Here, when X is ≤0.001, environmental resistance becomes inferior. When X exceeds 0.6, migration resistance between fine pitch bump becomes worse.
JPS60142489 | IC CARD |
JPS62208999 | MEMORY CARD |
JP2009093507 | RFID TAG |
MATSUURA KOUYA