Title:
異方性導電フィルム
Document Type and Number:
Japanese Patent JP5768454
Kind Code:
B2
Abstract:
An anisotropic conductive film comprising a heat-curable epoxy resin composition and conductive particles dispersed in the heat-curable epoxy resin composition, wherein the heat-curable epoxy resin composition comprises an epoxy resin, a curing agent for epoxy resins and a film-forming resin, and wherein the epoxy resin to be used comprises a ß-alkylglycidyl-type epoxy resin and a glycidyl-ether-type epoxy resin at a ratio of 9:1 to 2:8 by mass. The ß-alkylglycidyl-type epoxy resin is preferably di(ß-methylglycidyl) resorcinol ether, and the glycidyl-ether-type epoxy resin is preferably an alkylene-oxide-modified glycidyl-ether-type epoxy resin.
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Inventors:
Shingo Deguchi
Application Number:
JP2011090211A
Publication Date:
August 26, 2015
Filing Date:
April 14, 2011
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
C08G59/20; C09J7/10; C09J9/02; C09J11/06; C09J163/00; C09J201/00; H01B1/22; H01B5/16; H01L21/60; H01R11/01; H01R43/00
Domestic Patent References:
| JP2010278025A | ||||
| JP2006137825A | ||||
| JP2005307031A | ||||
| JP2007269979A |
Attorney, Agent or Firm:
Taji U.S. Patent Office