To provide an anisotropic conductive material that has high adhesion of a cured product and that maintains high adhesion for a long period of time, and a connection structure using the anisotropic conductive material.

The anisotropic conductive material can be cured by heating. The anisotropic conductive material includes a curable compound, a thermal cation generator for thermal curing of the curable compound, an organometal compound, and a conductive particle 5. The organometal compound is an organotitanate compound, an organozirconate compound, or an organoaluminum compound. The connection structure 1 includes a first connection object member 2, a second connection object member 4, and a connection part 3 which electrically connects the first and second connection object members 2 and 4. The connection part 3 is formed from the anisotropic conductive material.