Title:
ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR CONNECTING INTEGRATED CIRCUIT ELEMENT USING THE SAME
Document Type and Number:
Japanese Patent JPH04117477
Kind Code:
A
Abstract:
PURPOSE: To obtain the title material which is useful for adhering an integrated circuit chip which forms an electrode pad and a glass substrate which has an electrode terminal and is capable of repairing the integrated circuit chip in the case of poor connection and is excellent in connection reliability and operation workability by dispersing conductive particles into a specific adhesive resin.
CONSTITUTION: The title material comprises a heat and light curable insulating adhesive resin and conductive particles dispersed therein.
Inventors:
MATSUI KOJI
ORITO NAONORI
ORITO NAONORI
Application Number:
JP23739290A
Publication Date:
April 17, 1992
Filing Date:
September 07, 1990
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K3/32; C09J5/00; C09J5/02; C09J9/02; C09J201/00; H01B5/16; H01L21/60; (IPC1-7): C09J5/00; C09J9/02; H01B5/16; H01L21/60; H05K3/32
Domestic Patent References:
| JPS60133079A | 1985-07-16 | |||
| JPS5785873A | 1982-05-28 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)