To improve workability while an anisotropic electroconductive adhesive film is temporarily adhered on a board by pressure, and at the same time, achieve a high trapping rate of electroconductive particles and reduce the risk of a short circuit between circuit lines.

An anisotropic electroconductive adhesive film obtained by imbedding electroconductive particles into an active ray-curing insulating binder layer consisting of a laminated film of an insulating adhesive layer and an active ray-curing insulating binder layer, and molding the binder layer into a monolayer. In the anisotropic film, the thickness of the active ray-curing insulating binder layer is not larger than the particle size of the electroconductive particles, and the active ray-curing insulating binder layer has an uncured state having tackiness before using. After the anisotropic electroconductive adhesive film is temporarily adhered by pressing on a board having an active ray permeability, it is irradiated with active rays to cure the binder layer immediately before permanent adhesion by pressure.