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Title:
ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE FILM AND METHOD FOR MANUFACTURING ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2008274196
Kind Code:
A
Abstract:

To provide an anisotropic electroconductive adhesive film which can prevent the deformation during heat treatment, and can impart an excellent cutting characteristics, by using a biodegradable film as a release film and a method for manufacturing the anisotropic electroconductive adhesive film.

The anisotropic electroconductive adhesive film comprises a first release film 2 having a first releasing layer 5 on one surface thereof, an adhesive layer 3 composed of the anisotropic electroconductive adhesive material formed on the first release film 2 through the first releasing layer 5, a second releasing film 4 formed via the second releasing layer 6 on the surface of the opposite side of the first releasing film 2 side of the adhesive layer 3 having a second releasing layer 6 on one surface, wherein the first and the second releasing film 2, 4 are composed of a nonshrink biodegradable film comprising an aliphatic polyester component as a base and having the first releasing layer 5 and the second releasing layer 6 comprising a silicon resin hardening 100C on each base.


Inventors:
NAGASHIMA MINORU
KAWASHIMA TADASHI
Application Number:
JP2007122783A
Publication Date:
November 13, 2008
Filing Date:
May 07, 2007
Export Citation:
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Assignee:
SONY CHEM & INF DEVICE CORP
International Classes:
C09J7/02; C09J9/02; C09J201/00; H01B5/16
Domestic Patent References:
JPH1021741A1998-01-23
JP2000280429A2000-10-10
JP2005181943A2005-07-07
Attorney, Agent or Firm:
Akira Koike
Eiichi Tamura
Seiji Iga