To provide a heat-curable anisotropic electroconductive adhesive capable of connecting microcircuits such as the connection of LCD to TCP, and that of the LCD to COF, to each other, in particular at a low temperature in a short time and having excellent adhesion, connection reliability, preservation stability and repairabilities.

This anisotropic electroconductive adhesive comprises (A) a radically polymerizable resin, (B), an organic peroxide, (C) a thermoplastic elastomer resin, (D) a resin having at least one or more epoxy groups in one molecule, (E) an aminosilane coupling agent, (F) a phosphoric acid ester, (G) an epoxysilane coupling agent, and electroconductive particles dispersed in the resin composition.