To provide an antenna circuit structure for IC card and tag, capable of enhancing reliability of a joint part between parts of antenna circuit pattern layers, and a method for manufacturing the same.
The antenna circuit structure for IC card and tag 1 comprises a resin film substrate 11, a first circuit pattern layer composed of a copper foil containing copper as a main component, which is formed on one surface of the substrate 11, and a second circuit pattern layer composed of a copper foil containing copper as a main component, which is formed on the other surface of the substrate 1. A part of the first circuit pattern layer is bonded to a part of the second circuit pattern layer opposed to the part of the first circuit pattern layer through the substrate 11 at contact bonding parts 13a and 13b by welding.
WATABE MASATERU
EGASHIRA KIYOJI
SAKAMOTO HIROYUKI
SHINGU TORU
| JP2000216537A | 2000-08-04 | |||
| JP2001312709A | 2001-11-09 | |||
| JPH10190217A | 1998-07-21 | |||
| JPH04274885A | 1992-09-30 |
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