To provide an antenna device which uses a foam dielectric resin that allows an antenna substrate to obtain broad band characteristics with low loss.

A microstrip patch type antenna patter 111 is formed on an upper surface of an antenna substrate 110, and a first ground 112 is formed on a bottom surface. Further, a feeder line 121 is formed on a bottom surface of a feeding substrate 120. The antenna substrate 110 is joined to the feeding substrate 120 at a joining layer 130, and the antenna patter 111 is electrically connected with the feeder line 121 via a metal pin 101. The metal pin 101 penetrates the antenna substrate 110 and the feeding substrate 120. One end 101a of the metal pin is soldered to the antenna pattern 111, and the other end 101b is soldered to the feeder line 121.