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Title:
アンテナパターンの製造方法、RFIDインレットの製造方法、RFIDラベルの製造方法及びRFID媒体の製造方法
Document Type and Number:
Japanese Patent JP7105333
Kind Code:
B2
Abstract:
A method for manufacturing an RFID inlet comprising thermal paper according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of an antenna pattern arranged on a continuous body of said thermal paper. The pressurising step is performed while conveying the continuous body of a base material.

Inventors:
Sadamitsu Maeda
Application Number:
JP2021039269A
Publication Date:
July 22, 2022
Filing Date:
March 11, 2021
Export Citation:
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Assignee:
SATO HOLDINGS CORPORATION
International Classes:
G06K19/02; G06K19/077; H01P11/00; H01Q1/38; H05K3/04
Domestic Patent References:
JP2006277700A
JP2003076969A
JP2007208115A
JP2006146786A
JP2005284332A
JP2007536606A
Attorney, Agent or Firm:
Goto Patent Office