To provide an anticorrosive exerting excellent anticorrosive effect even in a system in which substance having strong oxidizing power such as hydrogen peroxide is coexistent, especially, to provide an anticorrosive by which copper corrosion in the case an LSI board or a printed circuit board with copper wiring applied is treated in the coexistence of hydrogen peroxide or the like and in a CMP stage for a copper wiring semiconductor substrate can effectively be prevented and to provide a method for preventing copper corrosion using the anticorrosive.

This anticorrosive for copper contains an epihalohydrin-modified polyamide or contains the epihalohydrin-modified polyamide and a benzotriazole compound, and the method for preventing corrosion uses the anticorrosive.