Title:
ANTIREFLECTION FILM COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3509760
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film composition having excellent adhesion property to a fluorocarbon resin resist and to form a fine resist pattern by applying a fluorocarbon resin resist to photolithographic techniques.
SOLUTION: An antireflection film 2 is formed by applying the antireflection film composition containing polymers containing fluorine and a solvent which dissolves the polymers on a semiconductor substrate 1. Then a resist film 3 containing fluorine is formed on the antireflection film 2 and the resist film 3 is irradiated with exposure light to form a resist pattern 4.
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Inventors:
Chokai, Minoru
Application Number:
JP2001032918A
Publication Date:
March 22, 2004
Filing Date:
February 08, 2001
Export Citation:
Assignee:
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC
International Classes:
C08K5/00; C08L101/04; G03F7/09; H01L21/027; G03F7/11; (IPC1-7): G03F7/11; C08K5/00; C08L101/04; H01L21/027
Attorney, Agent or Firm:
高田 守 （外２名）
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