Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ANTISTATIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0326759
Kind Code:
A
Abstract:
PURPOSE:To provide an antistatic resin composition having permanent and excellent antistaticity and containing a thermoplastic resin having a specific melting point or heat-deformation temperature and a specific polyamide imide elastomer at a specific ratio. CONSTITUTION:The objective composition contains (A) a thermoplastic resin having a melting point of <=200 deg.C or a heat-deformation temperature of <=180 deg.C (e. g. low density polyethylene or nylon 12) and (B) a polyamide imide elastomer having a relative viscosity of 1.5-2.5 (at 30 deg.C) and derived from (B1) caprolactam, (B2) a trivalent or tetravalent aromatic polycarboxylic acid capable of forming one or more imide rings (e. g. pyromellitic acid), (B3) polyoxyethylene glycol or a polyoxyalkylene glycol mixture composed mainly of polyoxyethylene glycol and, as necessary, (B4) 40-80wt.% (based on the component B) of a 2-10C diamine at a weight ratio (A:B) of 75:25 to 95:5.

Inventors:
SUZUKI YOSHIO
NAKAMURA MIKIHIKO
Application Number:
JP15974389A
Publication Date:
February 05, 1991
Filing Date:
June 23, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI CHEMICAL IND
International Classes:
C08L23/02; C08L5/00; C08L25/04; C08L73/00; C08L79/08; C08L87/00; (IPC1-7): C08L5/00; C08L23/02; C08L25/04; C08L79/08
Attorney, Agent or Firm:
Akira Agata (2 outside)



 
Next Patent: JPH0326760