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Title:
APPARATUS FOR CASTING SILICON
Document Type and Number:
Japanese Patent JP2005279663
Kind Code:
A
Abstract:

To provide an apparatus for casting silicon in which a problem that the yield of the silicon is caused to reduce by peeling off and damaging releasing material coated on the inner surface of a mold and mixing into the molten silicon, is solved, when the molten silicon is tapped off into the mold.

This casting apparatus is provided with heating means 6, 7, a melting crucible 1 for forming the molten silicon by heating and melting silicon raw material 3 held in the inner part with the heating means 6, 7, a molten silicon tapping hole 4 arranged at the bottom part of the melting crucible 1 and tapping off the molten silicon, the mold 8 arranged at the lower part of the melting crucible 1 and having the opening part at the upper part and also, for holding and solidifying the molten silicon 10 tapped off from the molten silicon tapping hole 4 in the inner part, the releasing material 9 arranged in the inner part of the mold 8 and for example, a mold driving device 11, as the molten silicon dispersing means further increasing the size of molten silicon colliding range collided against the releasing material 9, arranged in the inner part of the mold 8 by dropping down the molten silicon 10 tapped off from the molten silicon tapping hole 4.


Inventors:
TSUCHIDA SHINKO
Application Number:
JP2004093937A
Publication Date:
October 13, 2005
Filing Date:
March 29, 2004
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
B22D33/02; B22D7/00; B22D7/12; B22D21/00; B22D27/08; C01B33/02; (IPC1-7): B22D21/00; B22D7/00; B22D7/12; B22D27/08; B22D33/02